Intevac to Present its Work on Fan-Out Packaging at SEMICON Korea 2018 Technology Symposium
Semiconductor device packaging technology in general, and fan-out wafer-level packaging (FOWLP) / fan-out panel-level packaging (FOPLP) technology in particular, is being driven by the strong cost advantages these advanced packaging technologies offer over the expense of implementing continued Moore's Law progress for sub-10nm semiconductor IC process nodes. Fan-out packaging provides for increased I/O (Input/Output) density for a given semiconductor device while simultaneously supporting smaller die sizes, thereby reducing the amount of space integrated circuit content occupies in handheld consumer electronic products, such as smartphones, wearables, and Internet of Things (IoT) devices.
The INTEVAC MATRIX® is a high-productivity, substrate-independent thin-film processing platform that is well-positioned for multiple fan-out packaging applications. The MATRIX Physical Vapor Deposition (PVD) system offers a much-reduced cost of ownership (COO) over the current PVD process tools being used for Redistribution Layer (RDL) barrier/seed layer applications, and also offers the flexibility to run multiple substrates on the same system, from wafer-level (round) substrates to panel-level (square or rectangular) substrates, which today are up to 600mm in diameter.
In addition to the SEMICON Korea 2018 presentation, Intevac's other
recent technical papers on advanced packaging processes developed on the
MATRIX were featured at IWLPC 2017 in
About SEMICON Korea
Since SEMICON Korea was kicked off in 1987, it has become one of the
biggest exhibitions in the Korean semiconductor industry. The number of
total attendees in 2018 is estimated at 40,000. SEMICON global trade
shows, organized by SEMI, are held in 8 countries where the
semiconductor industry is flourishing:
The SEMI Technology Symposium (STS) 2018, held in conjunction with SEMICON Korea 2018, will provide a dynamic agenda of sessions and presentations on a wide variety of subjects in the area of next-generation semiconductor manufacturing. Topics covered include: Advanced Lithography, Interconnection & Advanced Processes, Devices, Plasma Science and Etching, Contamination-free Manufacturing and CMP Technology, and Electropackage Systems and Interconnects.
For more information visit www.semiconkorea.org/en/.
In our Thin-film Equipment business, we are a leader in the design and development of high-productivity, thin-film processing systems. Our production-proven platforms are designed for high-volume manufacturing of substrates with precise thin film properties, such as the hard drive media, display cover panel, and solar photovoltaic markets we serve currently.
In our Photonics business, we are a recognized leading developer of
advanced high-sensitivity digital sensors, cameras and systems that
primarily serve the defense industry. We are the provider of integrated
digital imaging systems for most
For more information call 408-986-9888, or visit the Company's website at www.intevac.com.
Vice President, New Business Development
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